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esp32listed

Chip-level ESP-IDF capability reference for the classic ESP32 SoC (dual-core Xtensa LX6) — what the chip can do, distinct from board wiring. Covers the ESP32-D0WDQ6-V3 / ESP32-D0WD-V3 / ESP32-D0WDR2-V3 die family used in ESP32-WROOM-32 and ESP32-WROVER modules. Use for RMT (IR/WS2812), LEDC (PWM), I2S (audio/parallel camera), ADC/DAC/touch (incl. ADC2-vs-WiFi conflict), PCNT, MCPWM, TWAI/CAN, SDMMC host + SDIO slave, the deprecated Hall sensor, ULP-FSM, deep sleep/hibernation, dual-core task pinning, WiFi/Bluetooth Classic+BLE coexistence, and what "V3" silicon changed vs older revisions. Trigger on RMT/LEDC/I2S/ULP/deep-sleep/ADC2 questions on a classic ESP32, D0WDQ6/D0WD/D0WDR2/WROOM/WROVER, or any M5Stack classic-ESP32 board (Core2, Basic, Fire, Tough, StickC-Plus, Atom-Lite/Matrix, Stamp-Pico, CoreInk, Paper) needing depth beyond its own SKILL.md. For pinouts/wiring use that board's skill — this is the shared chip layer it points into.
iot-forge/m5stack-skills · ★ 2 · AI & Automation · score 73
Install: claude install-skill iot-forge/m5stack-skills
# ESP32 (classic) chip capabilities This skill is the **chip layer**, not a board layer. A board skill (e.g. `m5stack-core2`) tells you what's wired to what on one specific product; this skill tells you what the classic ESP32 silicon itself can do — the peripherals, low-power modes, memory options, and concurrency model that are the same on every classic-ESP32 board regardless of vendor. Read a board's own skill first for pin numbers and I2C addresses, then come here when the user wants to go deeper on a capability than "call the vendor's high-level library and move on" — e.g. writing a custom RMT-based protocol, understanding why an ADC read returns garbage once WiFi turns on, tuning deep-sleep/hibernation wake behavior, or pinning tasks to cores. ## What "ESP32-D0WDQ6-V3" actually names This is the oldest and most fragmented naming scheme in the family, worth untangling explicitly: - **D0WD / D0WDQ6 / D0WDR2** identify the *die + package*, not a firmware target — all three are the same dual-core Xtensa LX6 silicon, differing only in package size and whether flash/PSRAM is bonded into the same package: - **ESP32-D0WD-V3** — QFN 5×5mm, no in-package flash or PSRAM (external only). - **ESP32-D0WDQ6-V3** — QFN 6×6mm (larger, more pins broken out for external QSPI), no in-package flash or PSRAM (external only). This is the die used inside **ESP32-WROOM-32** modules, which add the external flash chip inside the module's own metal can — the bare D0WDQ