plasma-etch-controller

# Plasma Etch Controller ## Purpose The Plasma Etch Controller skill provides comprehensive plasma etching process control for nanofabrication, enabling anisotropic pattern transfer with optimized selectivity, profile control, and minimal damage. ## Capabilities - Etch chemistry selection - Anisotropy and selectivity optimization - Endpoint detection - Profile and sidewall angle control - Loading effect compensation - Plasma damage assessment ## Usage Guidelines ### Plasma Etch Process 1. **Chemistry Selection** - Match chemistry to material - Consider selectivity requirements - Address sidewall passivation 2. **Profile Control** - Optimize ion energy - Balance chemical and physical - Control sidewall angle 3. **Endpoint Detection** - Use OES for species monitoring - Apply interferometry - Implement time-based backup ## Process Integration - Nanolithography Process Development - Nanodevice Integration Process Flow ## Input Schema ```json { "material": "string", "mask_type": "string", "target_depth": "number (nm)", "feature_cd": "number (nm)", "selectivity_requirements": { "to_mask": "number", "to_underlayer": "number" } } ``` ## Output Schema ```json { "etch_recipe": { "gases": [{"gas": "string", "flow": "number (sccm)"}], "pressure": "number (mTorr)", "rf_power": "number (W)", "bias_power": "number (W)" }, "etch_rate": "number (nm/min)", "selectivity": { "to_mask": "number", "to_und...